YRH Hybrid Mounter Features

Yamaha's proprietary flip-chip hybrid mounter, most suitable for module devices composed of semiconductors and SMDs. It is capable of various types of production processes, and the YRH10 achieves SMT for semiconductors and SMDs in a single unit. Post-mount inspection is provided as a standard feature.

• Hybrid Mounting
  Achieves hybrid mounting of semiconductors and SMDs
• High-Speed, High-Precision Mounting
  ±15μm (Cpk≧1.0) CPH10,800 (with wafer supply)  Note: Under optimal conditions
• Upgraded Component Supply
  Smart Feeder
• Handling Large PCBs
  L330 x W250mm

Tray Types

High-Speed, High-Precision Mounting
The mounter with 10 nozzles on the mounting head achieves high productivity while maintaining a high level of mounting precision.

Inline Head with Scanning Camera
A high-speed flexible head cover for everything from ultra-small components to medium-sized odd-form components. Using a scanning camera, the operating distance from pickup to mounting is minimized, achieving high productivity.


Scanning Camera
Multi-Accuracy Compensation System (MACS)
New compensation function + high-precision positioning
Yamaha's proprietary compensation system achieves high mounting precision of ±15μm (μ+3σ).


Compatible with Smart Feeders and Various Options
Compatible with smart feeders to improve pick-up accuracy for tape-and-reel components.
Combined with the Multi-Accuracy Compensation System, it achieves high-precision component pickup and mounting.

ZS Feeder
Compatible with electric smart feeders and also used in the machine. The compact and lightweight feeder improves operability and reduces operator burden.

Auto-Loading Feeder
Also supports auto-loading feeders that can pre-set two reels. This type eliminates the need for splicing and allows changing the power timing. This significantly reduces downtime due to component depletion.

Various Options
Nozzle Station
Automatically changes special and backup nozzles.
Compatible with nozzle stations, blow-off stations, and other options for various applications.

Options

• Nozzle Station
• Blow-Off Station
• PCB Height Measurement Laser Sensor
• Nozzle Height Compensation Touch Sensor
• Multi-Camera
  (Optional front full set, field of view: 20mm)
• Static Eliminator (Tape Feeder Side and Wafer Side)
• IT Option^Note
• YSUP Programming / YSUP Material Information^Note
• Dipping Station

• Wafer Mapping (with Barcode Reader)^Note
• Pin Sensor
• Machine Internal LED Light
• Temporary Fixation Station
  (Mounted on the machine front: up to 1 unit)
• Port Cover (Conveyor Port Safety Cover)
• QFP Recovery Conveyor
• Monitor Offset
• Reel Stand
• Empty Tape Cassette
• Flat Ring Tray (Extended 6.8 inches)